At a time when the market of high performance computing (HPC) has been growing in may part of the world, Huawei and Intel have signed a memorandum of understanding (MOU) where the former would be deploying Intel Xeon Phi and Intel Xeon Phi processors in it servers, which when clustered in planned manner generate supercomputing capability.
Huawei will also build HPC innovation centers in Shenzhen and Chengdu, China, as well as in Munich, Germany. At these centers, the two parties may carry out joint initiatives such as application optimization, technical training and community development, so that they can provide cutting-edge HPC solution experience and services for customers. Additionally, they will carry out joint exploration and marketing events across the globe.
“The combining of big data, cloud, artificial intelligence (AI), and traditional HPC is bringing new opportunities and vitality to the entire HPC industry. This trend also extends the application of HPC from traditional domains such as CAE simulation, scientific research computing, and oil and gas exploration towards nascent domains such as financial services and network security”, said Qiu Long, President, IT Server Product Line, Huawei. “Huawei has synergized its leading engineering and chip expertise in the hardware space with its strength in big data and cloud computing. This well positions Huawei for accelerating the HPC industry upgrading as the new opportunities arrive. Huawei will strive to provide customers with leading-edge solutions to help them better compete in emerging sectors such as HPC Cloud, HPDA, and HPC &AI. Intel has been pioneering the HPC industry and is also the most important partner to Huawei in the server domain. The kick start of both parties’ deep collaboration in HPC sets a new milestone in our collaboration history. Together we will enrich the HPC industry with more innovations and empower our customers with more compelling HPC solutions:, added he.
Peter Chen, General Manager of Products & Technology, Data Center Group Sales Group, Intel, said, “Intel is keen to see acceleration of the HPC market through deeper collaboration with Huawei. Intel Xeon processors and Intel Xeon Phi processors, as wells as our low-latency Intel Omni-Path Architecture fabric, deliver the performance demanded by HPC applications”. “Intel will work closely with Huawei on product development, innovation lab and technology training. Our engagement also covers marketing alignment. We are excited on the partnership and how Huawei and Intel can transform HPC market together”, viewed Chen.
Last November, Intel joined Huawei at Supercomputing Conference 2016 (SC16) to launch the new-generation all-flash based HPC platform, FusionServer X6000. This March, Intel joined Huawei at CeBIT2017 to release the Intel OPA solution based Huawei E9000 blade server. For industrial CAE simulation and simulation for scientific research purposes, Huawei offers a variety of HPC solutions based on FusionServer high-density servers and the KunLun. Currently, Huawei has successfully helped many automobile manufacturers, large supercomputing centers, universities, and scientific research institutions deploy HPC clusters.